THESIS
2018
xv, 87 pages : illustrations ; 30 cm
Abstract
As the amount of transistors double every two years as described by Moore’s law and the
energy density increases correspondingly, the huge amount of heat generated cannot be
dissipated efficiently. Thermal interface materials (TIMs) is one of the cooling solutions
applied between chip-chip interface and chip-substrate interface. Owing to the high in-plane
thermal conductivity of graphene (Gr), this low-dimensional carbon-based nanomaterial has
been studied for thermal dissipation. Matrix-free Gr carpets have also been demonstrated as
high performance heat-spreaders in electronic packaging. However, the performance of
graphene as a TIM was limited due to the poor out-of-plane thermal conductivity. Herein, this
work is focused on developing 3D Graphene foam with dielectric propert...[
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As the amount of transistors double every two years as described by Moore’s law and the
energy density increases correspondingly, the huge amount of heat generated cannot be
dissipated efficiently. Thermal interface materials (TIMs) is one of the cooling solutions
applied between chip-chip interface and chip-substrate interface. Owing to the high in-plane
thermal conductivity of graphene (Gr), this low-dimensional carbon-based nanomaterial has
been studied for thermal dissipation. Matrix-free Gr carpets have also been demonstrated as
high performance heat-spreaders in electronic packaging. However, the performance of
graphene as a TIM was limited due to the poor out-of-plane thermal conductivity. Herein, this
work is focused on developing 3D Graphene foam with dielectric properties and synthesizing
and testing Graphene based composites as thermal interface materials.
In this work, three types of 3D Graphene structures, freestanding dielectric Graphene foam
(GF@Al
2O
3), Graphene oxide coated Cu (Cu@GO) and Aluminum oxide decorated reduced
Graphene oxide coated Cu (Cu@rGO@Al
2O
3) are reported. It is demonstrated according to
the experimental results that there’s dramatically enhancement in thermal and dielectrical
properties. Meanwhile, the interfacial modification on GF by phase change metal alloy (PCMA)
is conducted which shows excellent reduction on thermal interface resistance.
This work is aimed to accomplish the practical application of Graphene as thermal
interface materials commercial products, which shows competitive thermal and mechanical
properties compared with traditional TIMs and to contribute my own effort solve the interfacial
thermal dissipation problems in electrical packaging fields.
Keywords: thermal interface materials, Graphene, Graphene foam, reduced Graphene oxide,
thermal conductivity, interface thermal resistance.
(Supervisors: Prof. Matthew Yuen, Prof. Baoling Huang)
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