MoS
2 and WSe
2 are two-dimensional semiconductors from the transition metal
dichalcogenide family. Owing to their good thermal stability, atomic layer thickness, and the
extraordinary mechanical, electric and optical properties, they have been under extensive
research in recent years. First, MoS
2 and WSe
2 can be used as ideal channel materials to
suppress the short-channel effect. Moreover, single-layer MoS
2 and WSe
2 also provide a great
platform to exploit the valley degree of freedom of electrons in solids for the possible electronic
applications. By stacking them together with other layered two-dimensional materials, such as
BN, versatile heterostructures of MoS
2 and WSe
2 with novel properties can be created.
However, even though with all these promises, the practical applicat...[
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MoS
2 and WSe
2 are two-dimensional semiconductors from the transition metal
dichalcogenide family. Owing to their good thermal stability, atomic layer thickness, and the
extraordinary mechanical, electric and optical properties, they have been under extensive
research in recent years. First, MoS
2 and WSe
2 can be used as ideal channel materials to
suppress the short-channel effect. Moreover, single-layer MoS
2 and WSe
2 also provide a great
platform to exploit the valley degree of freedom of electrons in solids for the possible electronic
applications. By stacking them together with other layered two-dimensional materials, such as
BN, versatile heterostructures of MoS
2 and WSe
2 with novel properties can be created.
However, even though with all these promises, the practical applications of MoS
2 and WSe
2
still face many challenges. Due to the lack of dangling bonds and thus the lack of nucleation
sites, it is challenging to integrate high-quality high-k dielectric on MoS
2 and WSe
2, which has
become a big obstacle in building MoS
2/WSe
2 devices with versatile structures or complicated
circuits. Besides the dielectric integration difficulty, metal contacts to MoS
2 and WSe
2 often
show strong Fermi level pinning, as a result, the devices often show large Schottky barrier and
contact resistance. Both the above challenges will unavoidably degrade the device performance
and hinder the further practical applications of MoS
2 and WSe
2.
To address these challenges, in this work, remote N
2 plasma treatment is explored as a
surface functionalization technique to enhance the dielectric deposition on MoS
2 and WSe
2.
First-principles calculations were also conducted to provide guidelines for using in-situ Raman
spectroscopy as a characterization tool to realize the real-time and quantitative monitoring of
the surface functionalization conditions and the possible defects. With remote N
2 plasma
treatment, ultrathin high-k dielectric was integrated on single-layer MoS
2, which was further
utilized as tunneling contact layer to effectively reduce the contact resistance of top-gate single-layer
MoS
2 metal-oxide-semiconductor field-effect transistors (MOSFETs). To realize these
objectives, the work in this thesis was divided into several parts:
1. Remote N
2 plasma was directly used as N source in a PEALD (plasma enhanced
atomic layer deposition) system to deposition AlN on MoS
2. This AlN layer was further used
as an interfacial layer to fabricate top-gate single-layer MoS
2 MOSFETs. The devices had
improved gate dielectric deposition and showed enhanced electrical stability.
2. The remote N
2 plasma treatment was explored as a surface functionalization technique
to promote the initial precursor adsorptions during ALD (atomic layer deposition) for MoS
2
and WSe
2. The N atom adsorptions on MoS
2 and WSe
2 surface are proved to function as anchors
to fasten the precursors. Uniform dielectric deposition on MoS
2 and WSe
2 was achieved. The
possible damages caused by remote N
2 plasma were characterized by Raman spectroscopy,
with remote O
2 plasma treatment as a comparison.
3. First-principles calculations were conducted to study the Raman spectra of MoS
2 and
WSe
2 with N and O atom adsorptions, aiming to explore the possibility of using in-situ resonant
Raman spectroscopy to monitor the real-time surface adsorptions. The theoretical results
suggest that in-situ Raman spectroscopy, specifically the acoustic-phonon Raman scattering, is
capable of providing important information to quantify the surface adsorptions and to realize
robust surface functionalization of MoS
2 and WSe
2.
4. The acoustic-phonon Raman scattering, which is a reflection of crystal defects or
adsorptions, was measured and analyzed for multilayer MoS
2 and WSe
2. The acoustic-phonon
Raman intensities in the multilayer MoS
2 or WSe
2 show a weaker resonance enhancement than
the first-order Raman intensities. In other words, if the Raman spectra are analyzed by the first-order
Raman peak normalization, multilayer MoS
2 or WSe
2 will intrinsically have a weaker
acoustic-phonon Raman intensity. This finding can contribute to the analysis of the crystal
defects in multilayer MoS
2 or WSe
2 by acoustic-phonon Raman scattering.
5. Using remote N
2 plasma treatment as the surface functionalization method, ultrathin
high-k dielectric was deposited on single-layer MoS
2, which was further used as a tunneling
contact layer to fabricate top-gate single-layer MoS
2 MOSFET. With an optimized layer
thickness, the high-k tunneling layer can effectively reduce the contact resistance.
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