THESIS
2015
xiii, [133] pages : illustrations (some color) ; 30 cm
Abstract
In the manufacturing process of electronic devices, particularly in the
die bonding process, high conductive adhesive is an important component as
this directly affects the performance of the devices in term of calculating speed
and reactions. In this study, we aimed at developing a highly dispersed
conductive CNTs/epoxy composite in isotropic and anisotropic, respectively.
Silver epoxy was our targeted studying adhesive because of its wide
applications in electronic packaging. Multi-walled carbon nanotubes (MWCNTs)
and micro sized silver flakes were conductivity promoter candidates. CNTs
would undergo surface functionalization to enhance dispersion in epoxy resin,
acidic treated multi wall carbon nanotubes (AtCNTs) and amino treated multi
wall carbon nanotubes (NH
2CNTs). Cha...[
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In the manufacturing process of electronic devices, particularly in the
die bonding process, high conductive adhesive is an important component as
this directly affects the performance of the devices in term of calculating speed
and reactions. In this study, we aimed at developing a highly dispersed
conductive CNTs/epoxy composite in isotropic and anisotropic, respectively.
Silver epoxy was our targeted studying adhesive because of its wide
applications in electronic packaging. Multi-walled carbon nanotubes (MWCNTs)
and micro sized silver flakes were conductivity promoter candidates. CNTs
would undergo surface functionalization to enhance dispersion in epoxy resin,
acidic treated multi wall carbon nanotubes (AtCNTs) and amino treated multi
wall carbon nanotubes (NH
2CNTs). Characterizations of each type of CNTs in
the way of microscopic and spectroscopic techniques would be carried out.
The isotropic conductive composite would be obtained through a deep
understanding of CNTs and Ag fillers loading effect on composite structure and
properties. Silver epoxy resin is firstly formulated from components. Then
different functionalized carbon nanotubes under different loadings are
incorporated into silver epoxy to enhance the conductive properties.
Morphology in terms of fillers dispersion in the CNTs/silver epoxy composite is
studied in order to achieve an ultimate goal of practical application of CNTs/Ag filling reinforced conductive adhesives.
The anisotropic conductive composite was obtained by a special
structure produced by a steady shearing of the well dispersed CNTs/epoxy
system. Ag nanoparticles were grafted onto the CNT in order to increase the
bulk conductivity of the silver grafted CNT (Ag@CNTs). Formation of CNT
band structure with Ag@CNTs was conducted in order to provide a high
conductive pathway along the CNTs band structure. Characterizations of the
Ag@CNTs, shearing conditions of CNTs band formation in terms of gap size
and shear rate, were interesting in the research. Microstructural components
rearrangement studies during band formation and morphology of CNTs band
were performed. Rheological studies with conductivity testing of different
functionalized CNTs were conducted. Finally, with the presence of the CNT
band structure, a bulk conductivity enhancement of 150 times was obtained
with the addition of 1vol% of CNTs.
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