THESIS
2022
1 online resource (xiii, 100 page) : illustrations (some color)
Abstract
Explosive data generation along with society development in education, health care,
scientific research, etc. challenges our current data transmission and processing systems,
especially for the servers in data centers which serve as data-relay stations. Benefitting
from silicon photonics and fiber optics, fast data routing and transmission with
enormous capacity in terms of broad bandwidth can be achieved by silicon photonic
chips and optical fibers, respectively. However, optical signals suffer from losses
accumulated in on-chip transmission and fiber-chip interface.
In this thesis, we propose the idea of heterogeneously integrated III-V-on-Si microring
resonator-based switch matrices to tackle the loss problem mentioned above in existing
pure-silicon switches. Because of the indirect-...[
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Explosive data generation along with society development in education, health care,
scientific research, etc. challenges our current data transmission and processing systems,
especially for the servers in data centers which serve as data-relay stations. Benefitting
from silicon photonics and fiber optics, fast data routing and transmission with
enormous capacity in terms of broad bandwidth can be achieved by silicon photonic
chips and optical fibers, respectively. However, optical signals suffer from losses
accumulated in on-chip transmission and fiber-chip interface.
In this thesis, we propose the idea of heterogeneously integrated III-V-on-Si microring
resonator-based switch matrices to tackle the loss problem mentioned above in existing
pure-silicon switches. Because of the indirect-bandgap nature of silicon, silicon
platform is not suitable for light emission and signal amplification while III-V materials,
such as InP and GaAs, can overcome these limitations. Heterogeneous integration
synthesizes both materials onto the same platform to adopt merit of each material.
Microring resonator working as a four-port device can route data between the through
and drop port which can serve as a single unit in a switch matrix. Unlike traditional
broad-band on-chip Mach-Zehnder interferometers (MZIs), microcavity resonators are
wavelength-selective which potentially embed wavelength division multiplexing
(WDM) into switching scheme and further increase the capacity of an optical switch.
We have designed a III-V-on-Si microring resonator for the single-unit in a switch
matrix. Our heterogeneous integration adopts an intermediate layer bonding technique
which includes atomic-layer deposited Al
2O
3 as the interfacial layer. Exploiting the
free-carrier plasma dispersion effect in III-V materials, we have achieved channel
switching between the through and drop ports of the resonator. To further enhance the
functionality of the switch, we also explore the ability of photo detection and emission
of III-V materials for on-chip power monitoring and signal amplification.
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